alpha brooks Book Archive


Electronics Reliability and Measurement Technology. by Joseph S. Heyman

By Joseph S. Heyman

Content material:

, Page v

, Pages vii-viii, Joseph A. Heyman
- government precis of findings and recommendations

, Pages 1-6
Measurement technological know-how and production technological know-how research

, Pages 7-16, D. Howard Phillips
Nondestructive SEM for floor and subsurface wafer imaging

, Pages 17-33, Roy H. Propst, C. Robert Bagnell, Edward I. Cole Jr., Brian G. Davies, Frank A. DiBianca, Darryl G. Johnson, William V. Oxford, Craig A. Smith
Surface inspection-research and development

, Pages 34-36, J.S. Batchelder
- Sensors constructed for in-process thermal sensing and imaging

, Pages 37-41, I.H. Choi, K.D. Wise
Wafer point reliability for high-performance VLSI design

, Pages 42-54, Bryan J. Root, James D. Seefeldt
Wafer point reliability trying out: an idea whose time has come

, Pages 55-59, O.D. Trapp
Micro-focus X-ray imaging

, Pages 60-67, Michael Juha
Measurement of opaque movie thickness

, Pages 68-78, R.L. Thomas, J. Jaarin, C. Reyes, I.C. Oppenheim, L.D. Favro, P.K. Kuo
Intelligent laser soldering inspection and procedure control

, Pages 79-88, Riccardo Vanzetti
Rupture checking out for the standard keep an eye on of electrodeposited copper interconnections in high-speed, high-density circuits

, Pages 89-106, Louis Zakraysek
- Heterodyne holographic interferometry: High-resolution ranging and displacement measurement

, Pages 107-122, James W. Wagner
- “Whole wafer” scanning electron microscopy

, Pages 123-128, J. Devaney
This web page is deliberately left blank

, Page 129

Show description

Read Online or Download Electronics Reliability and Measurement Technology. Nondestructive Evaluation PDF

Similar electronics books

LED Lighting: A Primer to Lighting the Future

We're near to a lighting fixtures revolution with light-emitting diodes--the tiny Leds you've noticeable in digital units for years. With this functional consultant, you'll cross behind the curtain to work out how and why brands at the moment are designing Led units to gentle every little thing from houses and places of work to streets and warehouses.

Pragmatic Logic (Synthesis Lectures on Digital Circuits and Systems)

Pragmatic common sense provides the research and layout of electronic good judgment structures. the writer starts with a short examine of binary and hexadecimal quantity structures after which seems on the fundamentals of Boolean algebra. The learn of common sense circuits is split into elements, combinational common sense, which has no reminiscence, and sequential common sense, which does.

Medical Biosensors for Point of Care (POC) Applications

Clinical Biosensors for aspect of Care (POC) functions discusses advances during this very important and rising box which has the aptitude to rework sufferer prognosis and care. half 1 covers the basics of clinical biosensors for point-of-care functions. Chapters partly 2 cross directly to examine fabrics and fabrication of clinical biosensors whereas the following half seems at varied applied sciences and operational innovations.

Additional resources for Electronics Reliability and Measurement Technology. Nondestructive Evaluation

Example text

Cumulative Cumulative Failures. Failures. Plot While System System Life Life Has Has Remained Remained the the Same, Same, Device Device Lifetimes Lifetimes Have Have Contracted. Contracted. While The conventional conventional methods methods of of reliability reliability screening, screening, that that of short-term short-term burn-in burn-in to eliminate eliminate infant infant life failures, failures, and and longo-term long--term The tests at at high high temperature, temperature, will soon become inapplicable for many many devices.

Phys. Lett. Lett. 48(9), 599 (1986). (1986). I. I. et. , Scanning Electron Microscopy and X-Ray Microanalysis, Plenum Press, (1981). Press! 53 ~(1981). [15]Reimer, [lS]Reimer, Scanning Electron Microscopy, Springer-Verlag, 286 (1985). (1985) • Nondestructive SEM SEM for for Surface Surface and and Subsurface Subsurface Wafer Wafer Imaging Imaging Nondestructive =-,"'EJCJ ETEC AUTOSCAN SEM o- n r p- p""-j2-3" , ; ' " ~~. ----- ---! LlTER 29 ~ s~~~ EBIC SIGNAL -+ ~~BIT ..... t,a. -- DATA ACOUISiTQN COMPUTER 1 1 AEO 512 COLOR MONITOR .

References: V. V. V. H. H. Propst, IEEE IEEE Trans. on Reliability, Vol. Vol. R-34, No. 5, 410 (1985). (1985). H. H. Propst, C. C. Bagnell, E. E. Cole, Cole, B. B. Davies, Davies, and W. W. Oxford, SRC Quarterly Report, Report, March 1984. 1984. A. A. DiBianca, C. C. Bagnell, E. E. Cole, Cole, D. D. Johnson, and W. Cf. Oxford, Scanning Electron Microscopy, Inc. Inc. 1, I, 57 (1986). (1986). C. C. Wells, Appl. Phys. Lett. Lett. 14, 14, 5 (1969). (1969). M. M. Taylor, J. J. Phys. Phys. D D 11, 11, 2443 (1978).

Download PDF sample

Rated 4.34 of 5 – based on 21 votes