By Joseph S. Heyman
, Page v
, Pages vii-viii, Joseph A. Heyman
- government precis of findings and recommendations
, Pages 1-6
Measurement technological know-how and production technological know-how research
, Pages 7-16, D. Howard Phillips
Nondestructive SEM for floor and subsurface wafer imaging
, Pages 17-33, Roy H. Propst, C. Robert Bagnell, Edward I. Cole Jr., Brian G. Davies, Frank A. DiBianca, Darryl G. Johnson, William V. Oxford, Craig A. Smith
Surface inspection-research and development
, Pages 34-36, J.S. Batchelder
- Sensors constructed for in-process thermal sensing and imaging
, Pages 37-41, I.H. Choi, K.D. Wise
Wafer point reliability for high-performance VLSI design
, Pages 42-54, Bryan J. Root, James D. Seefeldt
Wafer point reliability trying out: an idea whose time has come
, Pages 55-59, O.D. Trapp
Micro-focus X-ray imaging
, Pages 60-67, Michael Juha
Measurement of opaque movie thickness
, Pages 68-78, R.L. Thomas, J. Jaarin, C. Reyes, I.C. Oppenheim, L.D. Favro, P.K. Kuo
Intelligent laser soldering inspection and procedure control
, Pages 79-88, Riccardo Vanzetti
Rupture checking out for the standard keep an eye on of electrodeposited copper interconnections in high-speed, high-density circuits
, Pages 89-106, Louis Zakraysek
- Heterodyne holographic interferometry: High-resolution ranging and displacement measurement
, Pages 107-122, James W. Wagner
- “Whole wafer” scanning electron microscopy
, Pages 123-128, J. Devaney
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, Page 129
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Additional resources for Electronics Reliability and Measurement Technology. Nondestructive Evaluation
Cumulative Cumulative Failures. Failures. Plot While System System Life Life Has Has Remained Remained the the Same, Same, Device Device Lifetimes Lifetimes Have Have Contracted. Contracted. While The conventional conventional methods methods of of reliability reliability screening, screening, that that of short-term short-term burn-in burn-in to eliminate eliminate infant infant life failures, failures, and and longo-term long--term The tests at at high high temperature, temperature, will soon become inapplicable for many many devices.
Phys. Lett. Lett. 48(9), 599 (1986). (1986). I. I. et. , Scanning Electron Microscopy and X-Ray Microanalysis, Plenum Press, (1981). Press! 53 ~(1981). Reimer, [lS]Reimer, Scanning Electron Microscopy, Springer-Verlag, 286 (1985). (1985) • Nondestructive SEM SEM for for Surface Surface and and Subsurface Subsurface Wafer Wafer Imaging Imaging Nondestructive =-,"'EJCJ ETEC AUTOSCAN SEM o- n r p- p""-j2-3" , ; ' " ~~. ----- ---! LlTER 29 ~ s~~~ EBIC SIGNAL -+ ~~BIT ..... t,a. -- DATA ACOUISiTQN COMPUTER 1 1 AEO 512 COLOR MONITOR .
References: V. V. V. H. H. Propst, IEEE IEEE Trans. on Reliability, Vol. Vol. R-34, No. 5, 410 (1985). (1985). H. H. Propst, C. C. Bagnell, E. E. Cole, Cole, B. B. Davies, Davies, and W. W. Oxford, SRC Quarterly Report, Report, March 1984. 1984. A. A. DiBianca, C. C. Bagnell, E. E. Cole, Cole, D. D. Johnson, and W. Cf. Oxford, Scanning Electron Microscopy, Inc. Inc. 1, I, 57 (1986). (1986). C. C. Wells, Appl. Phys. Lett. Lett. 14, 14, 5 (1969). (1969). M. M. Taylor, J. J. Phys. Phys. D D 11, 11, 2443 (1978).